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Capital Advanced Technologies 制造用于原型开发和制造的产品，是行业领导者。Surfboards® 表面贴装试验板和适配器可支持各式各样的表面贴装器件和电路配置。Uni-Sip™ 试验板为采用通孔元件的电路结构提供模块化解决方案。这些产品组合在一起扩大了传统试验板技术的范围，包括新元件技术并实现了更高效的互连性。
Capital Advanced Technologies today is a product of a diversified electronics manufacturing and process background acquired in over Thirty years of existence. Founded in 1980, The company began as a producer of high quality printed circuit boards for both the commercial and military markets. While Capital produced boards across the spectrum of types such as single-sided, double-sided, and multilayer A particular emphasis was placed on the utilization and development of techniques and processes that could enhance the base board performance. During this period Capital was producing boards that incorporated features such as printed polymer thick film ground planes and shields, Printed Resistors, Capacitors, Detectors, Transducers, Electroluminescent Lamps, and a variety of hybridization's of mixed polymer thick film and traditional printed circuit technology.
In the following decade Capital broadened its focus to include Design, Assembly, and test of electronics at the hybrid, board, and system levels with a particular emphasis on Surface Mount and Miniaturization technologies. In this period the company continued development of its surface mount and hybrid packaging processes with much success.
Today, While still producing a wide range of products for the electronics industry, Capital is also focused on the needs of engineers faced with the task of building breadboard or prototype circuits with traditional and Surface Mount technology as well as converting to Surface Mount from traditional through-hole. Capital now produces a line of products to address those needs as well as help the customer to transition to volume as the need arises. To that end Capital can provide a wide range of manufacturing services to help get your ideas to market.
